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千赢国际固晶锡膏开售了

发布时间:2016-03-30

千赢国际介绍 PRODUCT DESCROPTION

 

PF-PLUS™ LD650 是一款专为 LED 倒装芯片应用设计的无铅免清洗锡膏。PF-PLUS™ LD650

 

采用超细、窄粒度分布、高球形度、低氧含量锡粉,可满足长时间的印刷或针转移工艺需求。

 

先进的芯片贴装可有效提高千赢国际效率、亮度,可靠性和寿命,能显著降低电子装配件的生产

 

成本,提高产量。

 

 

PF-PLUS™ LD650 is a lead-free, no-clean solder paste designed for flip chip LED interconnects. PF-PLUS™ LD650 is designed to enable the use of ultra-fine powder and narrow particle size distribution alloy .Its special system has long work life and is suitable for applications that require reproducible solder transfer by printing or pin transfer over several hours. Advanced technologies can help to improve efficiency and brightness, reliability and lifetime, and can also help to lower total cost of the product.


特性及优势 FEATURES & BENEFITS

 

热导率是普通银胶的 2-3 倍,保证大功率芯片的散热要求,提高 LED 使用寿命;

 

High thermal conductivity: The thermal conductivity is 2-3 times as conductive silver glue, ensuring high power die cooling requirements, improving the LED service life.

 

对于 5mil-75mil 超细孔径也能达到很好的金属结合能力。

 

Excellent coalescence for fine and ultra-fine feature deposits,as small as 5-75mil.

 

焊后残留物性状稳定、无腐蚀、颜色透明,不影响 LED 发光效果

 

It leaves a clear, colorless high resistivity residue after reflow, no affect on the LED luminous efficiency..

 

符合 IPC 7095 **的空洞性能类别,达到 IPC 第 3 等级的标准。

 

Good void performance (IPC Class III)。

 

选用超细、窄粒度分布锡粉制备,不论是沾胶工艺还是印刷工艺均能够实现对锡量的精 准控制。

应用 APPLICATION

 

粘胶工艺,点胶周期达到 200-250ms,粘晶周期为 130-160ms,粘胶量均一稳定,无

 

拉尖拖尾甩胶;

 

For dip process, the dip cycle can be 200-250ms and patch cycle can be 130-160ms, the paste amount is stable and no tailing.

 

印刷工艺,能够保证 0.12mm 开孔下锡及脱模要求,连续印刷粘度稳定;

 

For printing process, it can meet stencil removal requirement of 0.12mm hole, and has stable viscosity during long-time printing.

 

物理特性 PHYSICAL INFORMATION

 

合金 Alloy:Sn96.5/Ag3.0/Cu0.5

 

锡粉粒径 Powder Size:Type6.5 (2-11µm, Compo standard), Type 6 (5-15μm, IPC J-STD-005) and Type 5 (15-25μm, IPC J-STD-005). 根据实际应用选择

 

残留物 Residue:Approximately 4% (w/w)

 

包装尺寸 Packaging Sizes:3g/针管(syringe), 10g/针管(syringe)

 

 

技术数据 TECHNICAL DATA

 

测试项目

 

测试结果

测试标准

CATEGORY

 

RESULTS

PROCEDURES

锡粉性能 POWDER PROPERTIES

 

 

 

 

 

 

合金成分 Alloy

 

Sn96.5/Ag3.0/Cu0.5

J-STD-006

比重 Density

 

7.3 g/cm3

 

熔点或熔程 Melting Point

 

217

DSC

锡粉粒径 Powder Size

 

2-11µm,

Compo standard

 

5~15µm, 15-25 µm

IPC-TM-650 2.2.14

 

 

化学特性 CHEMICAL PROPERTIES

 

 

 

 

 

 

助焊剂类型

 

ROL0

J-STD-004B

 

 

 

 

助焊剂酸值 Acid value

 

220 mg KOH/g

GB/T 9491-2002

铜板腐蚀测 Copper Corrosion Test

 

PASS

JIS Z 3284

铜镜测试 Copper Mirror Test

 

PASS

JIS Z 3197

 

焊接 SOLDERING

 

PF-PLUS™ LD650 特有的助焊膏体系,适用于多种焊接工艺曲线。为了实现较好的焊接结

 

果,超过合金液相线温度以上时间建议 60-90s,峰值温度应高于合金液相温度约 25-40℃。

 

PF-PLUS™ LD650 is formulated for wide reflow profile window. To achieve better soldering performance, the acceptable temperature range above the melting point of the solder alloy is 25-40 ℃,and time above liquid state is 60~90 s.

 

下图为 PF-PLUS™  LD650 的推荐回流曲线,具体的炉温设置需根据现场工艺设计、元器

 

件和焊接炉的实际情况进行调整。

 

The following profiles are recommended, while the actual profile can be adjusted based on the process and others.